There is disclosed a novel high heat flux liquid cooled semi-conductor heat sink structure suitable for mounting semi-conductor chips such as IC's, hybrids, lasers, and power semi-conductors, said heat sink being made of metals, such as tungsten or Molybdenum; ceramics such as alumina, Beryllia, aluminum...http://www.google.com.au/patents/US4712609?utm_source=gb-gplus-sharePatent US4712609 - Heat sink structure
