A method for minimizing the critical dimension growth of a feature on a semiconductor wafer includes performing an etch operation in a reactor 20 and controlling the temperature of the wafer 26 by controlling the pressure of the gas contacting the backside of the wafer 26 and/or providing a heat source...http://www.google.com.au/patents/US6046116?utm_source=gb-gplus-sharePatent US6046116 - Method for minimizing the critical dimension growth of a feature on a semiconductor wafer
