An electronic device is solder bonded properly without using fluxes nor precise positioning with respect to a substrate. A bond pad with a size about twice the size of terminal pad of the electronic device is formed in a region on the substrate where the electronic device is to be mounted. After placing...http://www.google.com.au/patents/US5973406?utm_source=gb-gplus-sharePatent US5973406 - Electronic device bonding method and electronic circuit apparatus
