An integrated circuit chip includes a silicon substrate, a first circuit in or over said silicon substrate, a second circuit device in or over said silicon substrate, a dielectric structure over said silicon substrate, a first interconnecting structure in said dielectric structure, a first pad connected...http://www.google.com.au/patents/US7969006?utm_source=gb-gplus-sharePatent US7969006 - Integrated circuit chips with fine-line metal and over-passivation metal
