Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in-situ test socket or probes at a die-attach station. Those assemblies using "wet" quick-cure epoxies for die attachment may be...http://www.google.com.au/patents/US20040263196?utm_source=gb-gplus-sharePatent US20040263196 - Method for in-line testing of flip-chip semiconductor assemblies
