A wafer polishing apparatus includes: a) a rotatable polishing platen; b) a polishing pad received outwardly of the polishing platen; c) a wafer carrier head, the wafer carrier head being mounted for selective rotation relative to the polishing platen; the wafer carrier head including a wafer carrier...http://www.google.com.au/patents/US5533924?utm_source=gb-gplus-sharePatent US5533924 - Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers
