The escape of signals from a semiconductor chip to a printed wiring board in a flip chip/ball grid array assembly is improved by repositioning the signals from the chip through the upper signal layers of the carrier. This involves fanning out the circuit lines through the chip carrier from the top surface...http://www.google.com.au/patents/US20050104221?utm_source=gb-gplus-sharePatent US20050104221 - High wireability microvia substrate
