A polishing head for a chemical mechanical polishing (CMP) apparatus. The polishing head includes a backplate, a retaining ring supported by the backplate, and a bladder member encircled by the retaining ring. The backplate of the polishing head comprises a driving plate biasedly coupled to a subcarrier...http://www.google.com.au/patents/US6159083?utm_source=gb-gplus-sharePatent US6159083 - Polishing head for a chemical mechanical polishing apparatus
