A semiconductor module is formed by alternately stacking resin boards 3 on which semiconductor chips 2 are mounted and sheet members having openings larger than the semiconductor chips 2 and bonded to the resin boards 3. The resin board 4 located at the bottom out of the resin boards 3 is thicker than...http://www.google.com.au/patents/US7365416?utm_source=gb-gplus-sharePatent US7365416 - Multi-level semiconductor module and method for fabricating the same
