An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond is described wherein the bond pad on a surface of the...http://www.google.com.au/patents/US7345358?utm_source=gb-gplus-sharePatent US7345358 - Copper interconnect for semiconductor device
