The present invention relates to non-selective slurries for chemical-mechanical polishing of a metal layer and a method for manufacturing thereof, and further to a method for forming a plug in an insulating layer on a wafer using such a slurry. More particularly, a slurry is provided for polishing chemically...http://www.google.com.au/patents/US6506682?utm_source=gb-gplus-sharePatent US6506682 - Non-selective slurries for chemical mechanical polishing of metal layers and method for manufacturing thereof
