The present invention provides an encapsulated 3-D conductive pillar and a method of formation thereof. Significant economic savings are achieved by filling a substantial portion of the volume of the pillar with a lesser expensive conductive material. Additionally, the encapsulated 3-D conductor pillar...http://www.google.com.au/patents/US6537912?utm_source=gb-gplus-sharePatent US6537912 - Method of forming an encapsulated conductive pillar
