A fine-pitch pin grid array for mounting an IC chip having a number of signal, ground and power contact pads thereon comprises a square as-fired ceramic substrate having a corresponding number of signal, ground and power metal filled vias located on the side portions of the surface thereof. Deposited...http://www.google.com.au/patents/US5089881?utm_source=gb-gplus-sharePatent US5089881 - Fine-pitch chip carrier
