A method of maintaining z-height of an integrated circuit component, such as a multi-chip module, a chip or a die, and of visualizing alignment of an integrated circuit package during positioning of an integrated circuit component, is disclosed. The method maintains the z-height of an integrated circuit...http://www.google.com.au/patents/US6333210?utm_source=gb-gplus-sharePatent US6333210 - Process of ensuring detect free placement by solder coating on package pads
