A method is provided for customizing the heat transfer from the walls of an electronic unit such as a semi-conductor chip or wafer by determining the required heat transfer characteristics of the units; drilling holes of a predetermined size and location in the walls of the unit with a high energy beam...http://www.google.com.au/patents/US4050507?utm_source=gb-gplus-sharePatent US4050507 - Method for customizing nucleate boiling heat transfer from electronic units immersed in dielectric coolant
