The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90 m and a porosity of...http://www.google.com.au/patents/US6761790?utm_source=gb-gplus-sharePatent US6761790 - Wiring board and method of manufacturing the same
