A method for manufacturing a plastic encapsulated integrated circuit (IC) package has steps for placing a diamond substrate in a lower cavity of an encapsulation mold such that the diamond substrate in the finished package underlies the die attach pad and a portion of the leads in close proximity to...http://www.google.com.au/patents/US6058602?utm_source=gb-gplus-sharePatent US6058602 - Method for encapsulating IC packages with diamond substrate
