In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40)...http://www.google.com.au/patents/US7842960?utm_source=gb-gplus-sharePatent US7842960 - Light emitting packages and methods of making same
