Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the...http://www.google.com.au/patents/US7508065?utm_source=gb-gplus-sharePatent US7508065 - Device package and methods for the fabrication and testing thereof
