Disclosed is a design method for plating of a printed circuit board (PCB) strip, in which a main plating line is optionally formed on a component side, a solder side, or an inner layer of the PCB strip by modifying a sub-plating line of the PCB strip used to manufacture a semiconductor chip package,...http://www.google.com.au/patents/US7065869?utm_source=gb-gplus-sharePatent US7065869 - Method for plating of printed circuit board strip
