A semiconductor package with multiple chips side-by-side disposed on a leadframe is revealed, primarily comprising a plurality of leads of a leadframe, a first chip, a second chip, and an encapsulant to encapsulate the chips where the chip thickness of the second chip is larger than the one of the first...http://www.google.com.au/patents/US7633143?utm_source=gb-gplus-sharePatent US7633143 - Semiconductor package having plural chips side by side arranged on a leadframe
