A flip chip interconnect system comprises and elongated pillar comprising two elongated portions, one portion including copper and another portion including solder. The portion including copper is in contact with the semiconductor chip and has a length preferably of more than 55 microns to reduce the...http://www.google.com.au/patents/US6578754?utm_source=gb-gplus-sharePatent US6578754 - Pillar connections for semiconductor chips and method of manufacture
