The invention, which relates to a method for fabricating metallic interconnects with copper-nickel-gold layer construction on electronic components, is based on the object of specifying a method by means of which it is possible to fabricate such metallic interconnects on different electronic components...http://www.google.com.au/patents/US7172966?utm_source=gb-gplus-sharePatent US7172966 - Method for fabricating metallic interconnects on electronic components
