In one aspect, the invention includes a method of forming a roughened layer of platinum, comprising: a) providing a substrate within a reaction chamber; b) flowing an oxidizing gas into the reaction chamber; c) flowing a platinum precursor into the reaction chamber and depositing platinum from the platinum...http://www.google.com.au/patents/US7719044?utm_source=gb-gplus-sharePatent US7719044 - Platinum-containing integrated circuits and capacitor constructions
