A small package is provided for a flash EEPROM memory. The small package uses terminals which are part of a bottom conductive layer of a circuit board. In this manner, the final package can be quite thin. The circuit board can be connected to the integrated circuits and passive devices and can be encapsulated...http://www.google.com.au/patents/US7053483?utm_source=gb-gplus-sharePatent US7053483 - Semiconductor package using terminals formed on a conductive layer of a circuit board
