Si, Al, Al plus TiN, and Ir02 are used as adhesion layers to prevent peeling of noble metal electrodes, such as Pt, from a silicon dioxide (5i02) substrate in capacitor structures of memory devices. ...http://www.google.com.au/patents/US20040197576?utm_source=gb-gplus-sharePatent US20040197576 - Adhesion layer for Pt on SiO2
