A process is provided for manufacturing a layer arrangement (1) having a bump for a flip chip or similar connection. The layer arrangement has a plurality of layers (2, 3, 4, 5, 6, 7, 11) made of solid material and stacked into a layer stack (8). A recess (10) that extends over several layers (2, 3,...http://www.google.com.au/patents/US6191489?utm_source=gb-gplus-sharePatent US6191489 - Micromechanical layer stack arrangement particularly for flip chip or similar connections
