A semiconductor device according to the present invention has reduced inductance on a power supply line, a grounding line, and signal lines. In this invention, to reduce the length of the power supply connection and that of the grounding connection, a power supply metal post and a grounding metal post...http://www.google.com.au/patents/US5309021?utm_source=gb-gplus-sharePatent US5309021 - Semiconductor device having particular power distribution interconnection arrangement
