A semiconductor component includes a stiffener, a circuit decal attached to the stiffener, and a semiconductor die attached to the stiffener. The circuit decal includes conductors which function as an internal signal transmission system for the component, and a mask layer which functions as a solder...http://www.google.com.au/patents/US20050179124?utm_source=gb-gplus-sharePatent US20050179124 - Method for fabricating semiconductor component with stiffener and circuit decal
