An improved method for fabricating Chip-on-Board memory modules using partially-defective memory chips or a combination of partially-defective and flawless memory parts, comprises mounting unpackaged (or a combination of packaged and unpackaged) memory parts to a printed circuit board using one or more...http://www.google.com.au/patents/US20030159278?utm_source=gb-gplus-sharePatent US20030159278 - Methods and apparatus for fabricating Chip-on-Board modules