An interconnect, a test system, and a test method for testing bumped semiconductor components, such as dice and packages, contained on substrates, such as wafers or panels, are provided. The test system includes the interconnect, a tester for generating test signals, and a wafer prober for placing the...http://www.google.com.au/patents/US6337577?utm_source=gb-gplus-sharePatent US6337577 - Interconnect and system for testing bumped semiconductor components with on-board multiplex circuitry for expanding tester resources
