Microelectronic devices and methods for filling vias and forming conductive interconnects in microfeature workpieces and dies are disclosed herein. In one embodiment, a method includes providing a microfeature workpiece having a plurality of dies and at least one passage extending through the microfeature...http://www.google.com.au/patents/US8084866?utm_source=gb-gplus-sharePatent US8084866 - Microelectronic devices and methods for filling vias in microelectronic devices
