The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs or with monolithic or stacked leaded...http://www.google.com.au/patents/US7335975?utm_source=gb-gplus-sharePatent US7335975 - Integrated circuit stacking system and method
