A modified plating solution that can be used to electroplate a high quality conductive material that can be effectively polished and planarized includes (1) a solvent, (2) an ionic species of the conductive material to be deposited, (3) at least one additive to improve electrical and structural properties,...http://www.google.com.au/patents/US6354916?utm_source=gb-gplus-sharePatent US6354916 - Modified plating solution for plating and planarization and process utilizing same
