A process for encapsulating an integrated circuit die (403) using a porous carrier (101). In one example, an adhesive structure (e.g. tape) is applied to a porous carrier. Integrated circuit die is then placed on the adhesive structure. The integrated circuit die is then encapsulated to form an encapsulated...http://www.google.com.au/patents/US7015075?utm_source=gb-gplus-sharePatent US7015075 - Die encapsulation using a porous carrier
