A redistribution metallization scheme combines solder bumps and wire bond pads in addition to existing bond pads to enhance the connectivity of a semiconductor device, especially in flip-chip applications. The fabrication method includes forming the additional bond pads during the redistribution deposition...http://www.google.com.au/patents/US6762117?utm_source=gb-gplus-sharePatent US6762117 - Method of fabricating metal redistribution layer having solderable pads and wire bondable pads
