Power semiconductor device structures and assemblies with improved heat dissipation characteristics and low impedance interconnections include a thermally-conductive dielectric layer, such as diamondlike carbon (DLC) overlying at least portions of the active major surface of a semiconductor chip, with...http://www.google.com.au/patents/US5532512?utm_source=gb-gplus-sharePatent US5532512 - Direct stacked and flip chip power semiconductor device structures
