An improved via and contact hole fill composition and method for using the composition in the dual damascene production of circuits is provided. Broadly, the fill compositions include a quantity of solid components including a polymer binder and a solvent system for the solid components. The boiling...http://www.google.com.au/patents/US20010056144?utm_source=gb-gplus-sharePatent US20010056144 - Fill material for dual damascene processes
