A method of removing material layer is disclosed. First, a semiconductor substrate is fixed on a rotating platform, where a remnant material layer is included on the surface of the semiconductor substrate. Afterward, an etching process is carried out. In the etching process, the rotating platform is...http://www.google.com.au/patents/US7884028?utm_source=gb-gplus-sharePatent US7884028 - Method of removing material layer and remnant metal
