A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives, first and second conductive layers and a dielectric base, wherein the first post extends from the dielectric base in a first vertical direction into a first opening in the first adhesive...http://www.google.com.au/patents/US20110287563?utm_source=gb-gplus-sharePatent US20110287563 - METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/DIELECTRIC/POST HEAT SPREADER
