A flip-chip mount board includes a circuit board provided with a plurality of conductor patterns to which a plurality of bumps provided on an electronic component can be connected via a connection medium provided on the conductor patterns. The conductor pattern includes at least one wiring pattern and...http://www.google.com.au/patents/US6229711?utm_source=gb-gplus-sharePatent US6229711 - Flip-chip mount board and flip-chip mount structure with improved mounting reliability
