A probe assembly for performing circuit inspection of semiconductor chips according to which a resin film with copper foil attached thereto is used to form a conductive portion including a vertical probe on the resin film by etching the copper foil, plural sheets of the resin film with the vertical probe...http://www.google.com.au/patents/US7501840?utm_source=gb-gplus-sharePatent US7501840 - Probe assembly comprising a parallelogram link vertical probe made of a metal foil attached to the surface of a resin film
