A method for forming contact pins adapted to form an electrical connection with a mating contact location is provided. In a first embodiment, the contact pins are formed on an interconnect used for testing a semiconductor die and are adapted to establish an electrical connection with the bond pads of...http://www.google.com.au/patents/US5495667?utm_source=gb-gplus-sharePatent US5495667 - Method for forming contact pins for semiconductor dice and interconnects
