A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold...http://www.google.com.au/patents/US6861294?utm_source=gb-gplus-sharePatent US6861294 - Semiconductor devices and methods of making the devices
