Removable extension areas electrically connected to the original die bond pad allow for testing connections to be made. After removal of the extension areas, the circuitry below the region of the extension areas can be seen through a microscope. The use of perforations and/or underlayer sections can...http://www.google.com.au/patents/US5886414?utm_source=gb-gplus-sharePatent US5886414 - Removal of extended bond pads using intermetallics
