The present invention is a thermal interface for IC chip cooling. One embodiment of the invention comprises a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally conductive enclosure. The enclosure is adapted to be placed between an IC chip and a heat sink to enhance...http://www.google.com.au/patents/US20050061474?utm_source=gb-gplus-sharePatent US20050061474 - Method and apparatus for chip-cooling
