An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent...http://www.google.com.au/patents/US20060012967?utm_source=gb-gplus-sharePatent US20060012967 - Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method
