A semiconductor device includes a semiconductor substrate on one side of which an integrated circuit and a plurality of connection pads connected to the integrated circuit are provided. An insulating film is provided on the plurality of connection pads except for parts of the connection pads and on the...http://www.google.com.au/patents/US8110882?utm_source=gb-gplus-sharePatent US8110882 - Semiconductor device with magnetic powder mixed therein and manufacturing method thereof
