A method for fabricating MEMS structures includes etching a recess in either an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure, or to the lower surface of the wafer that is bonded to the substrate. Accordingly, once the etching processes of the wafer are...http://www.google.com.au/patents/US6846724?utm_source=gb-gplus-sharePatent US6846724 - Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge
