Methods and a platen control parameters of a removal rate characteristic in chemical mechanical planarization, while allowing a low-cost polishing pad to be used especially in fast edge operations, and while reducing the amount of fluid used to support the polishing pad. Platen configuration provides...http://www.google.com.au/patents/US6955588?utm_source=gb-gplus-sharePatent US6955588 - Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
